Global industries face immense pressure to enhance energy efficiency and reduce carbon footprints amidst rising energy costs and stringent environmental regulations. The rapid expansion of data centers, the electrification of transportation, and the push for circular economies in manufacturing all demand advanced thermal management solutions. This technology directly addresses these challenges by enabling high-performance, stable heat storage and release, offering a competitive edge to adopters in these high-growth sectors.
Enhances heat transport and storage density with COF single crystals over 120μm, significantly improving energy utilization efficiency.
Enables high-efficiency heat management from -20°C to 200°C, utilizing phase change and adsorption/desorption for diverse industrial applications.
Provides optimal material design flexibility for various applications, with superior stability contributing to long-term operational cost reductions.
This patent protects a multifaceted technical scope with 12 claims, ensuring broad applicability. It was granted after overcoming two office actions, demonstrating robust patentability against five prior art documents and suggesting high resilience against future invalidation challenges.
This patent primarily covers the COF composite material and its manufacturing method for heat storage. White space exists in developing specific device integration architectures, advanced sensing and control systems for thermal regulation, or novel applications in extreme temperature ranges beyond the specified -20 to 200°C.
Implementing this technology in cooling/heating systems for large factories and data centers could reduce annual power consumption by up to 20%. For example, a facility with an annual electricity cost of ~$3.5M (AI est.) could see annual savings of ~$0.5M (AI est.). Multiple facilities could achieve multi-million dollar savings.
X: Thermal Efficiency & Energy Conversion
Y: Material Longevity & Stability