Market Context — Why This Technology, Why Now

The global push for energy efficiency and compact, high-power electronic systems is intensifying across industries. Regulatory demands for EV battery safety and performance, coupled with competitive pressures for smaller, faster 5G/6G infrastructure and AI hardware, necessitate materials that can manage extreme thermal loads without compromising electrical integrity. This technology directly addresses these market forces by enabling robust, high-performance thermal insulation solutions.

Key Competitive Advantages
01

Achieves high thermal conductivity (15-35W/m·K) and dielectric strength (over 95kV/mm) simultaneously.

02

Enables superior processability and mass production due to thermoplastic resin (PMMA) matrix, easily integrating with existing molding processes for complex shapes.

03

Ensures stable and uniform performance across the product by precisely controlling the orientation and density of thermal filler particles.

Market Opportunity
EV Battery Modules
$3B–$4B globally (AI est.)
With the accelerating adoption of EVs, battery safety and efficient thermal management are paramount. This technology enhances heat dissipation and insulation within battery packs, contributing to extended range and improved safety.
Tier 1 automotive battery manufacturers EV powertrain component suppliers Battery management system developers
5G/6G Communication Equipment
$1.5B–$2.5B globally (AI est.)
Achieving high-speed, high-capacity communication requires denser and higher-power base stations and devices. Balancing heat dissipation with insulation reliability is key to ensuring communication stability and miniaturization.
Telecommunications infrastructure providers High-frequency component manufacturers Data center equipment suppliers
Industrial Power Modules
$1B–$2B globally (AI est.)
Demand for power semiconductors is increasing in industrial sectors requiring high efficiency and reliability, such as renewable energy, factory automation, and robotics. This technology improves product lifespan and reliability.
Industrial automation equipment manufacturers Renewable energy system integrators Power semiconductor packaging companies
IP Defensibility — Why Competitors Can't Replicate This
What This Patent Covers

This patent protects a composite insulating board with a specific material composition, density, thermal conductivity (15-35W/m·K), dielectric strength (over 95kV/mm), and filler particle orientation, along with its manufacturing method. The claims were successfully granted after a single office action, indicating strong novelty and inventiveness, making it a robust and difficult-to-invalidate patent.

Competitive White Space

This patent primarily covers the material composition and manufacturing process for the composite board. White space exists in developing novel cooling system architectures that integrate this material, or exploring its application in extreme radiation or vacuum environments.

Economic Impact
~$3.5M/year estimated cost reduction per facility (est.)
estimated ROI · USD · AI analysis
ROI Calculation Logic

Applying this technology to power modules could enable miniaturization and simplification of existing cooling systems (e.g., heatsinks, fans). Assuming a component cost reduction of ~$65/unit (AI est.), a company manufacturing 50,000 power modules annually could achieve ~$3.25M (AI est.) in annual cost savings. Additionally, extended product lifespan is estimated to reduce maintenance costs by ~$50K/year (AI est.), totaling an expected economic impact of ~$3.3M/year (AI est.).

Speed to Market
6× faster than in-house development
This technology is a research outcome from a national university corporation, and it is presumed that fundamental technical verification regarding the material design, manufacturing method, and performance evaluation of the composite insulating board has been completed. Specifically, the patent specification details the composition and manufacturing conditions for achieving both specific thermal conductivity and dielectric strength, eliminating the need for licensees to conduct R&D from scratch. This significantly shortens the time to market compared to in-house development, increasing the likelihood of early product launch.
Competitive Positioning

X: Thermal Dissipation & Dielectric Strength Balance
Y: Processability & Mass Producibility

Business Models & Applications
📝 Material Licensing
License the material composition, including the manufacturing method, enabling licensees to produce and sell composite insulating boards for their own products. This accelerates the market entry of high-performance materials.
🤝 Joint Development & Product Integration
Collaboratively develop and integrate composite insulating boards optimized for specific licensee products (e.g., EV inverters, power semiconductor packages). Customization maximizes performance.
💡 Solution Provision
Offer design, material selection, and manufacturing process consulting as a thermal management and insulation solution based on this technology, supporting clients in solving their challenges.
Adjacent Application Opportunities
🚀 宇宙・航空
Lightweight, High-Reliability Aerospace Electronics
Space electronics demand stable operation and extended lifespan in extreme temperature environments. This technology could provide lightweight yet superior heat dissipation and insulation, potentially improving the reliability of satellite and probe electronic components by up to 30%.
🔋 定置型蓄電池
High-Efficiency, Safe Stationary Battery Systems
The growth of renewable energy drives demand for stationary battery storage. Achieving high capacity and safety requires efficient thermal management and robust insulation between battery cells. This technology is expected to contribute to a 20% improvement in thermal stability and safety for such systems.
🏥 医療機器
Compact, High-Performance Medical Electronic Devices
Medical devices like MRI and ultrasound equipment are becoming more precise and compact. This technology, which efficiently dissipates internal heat while maintaining high insulation, could enhance diagnostic accuracy and patient safety by enabling up to 15% smaller, more reliable devices.
Integration Roadmap — Estimated 18-Month Deployment
Phase 1: Technology Evaluation & Material Selection
Duration: 3 months
Optimize selection of thermoplastic resin and BN particles to match licensee product specifications. Conduct detailed evaluation of the patented technology and its applicability to manufacturing processes.
Phase 2: Prototyping & Performance Validation
Duration: 6 months
Manufacture composite insulating boards on a small-scale prototype line using selected materials. Evaluate performance metrics such as thermal conductivity, dielectric strength, and mechanical properties, and refine the manufacturing process.
Phase 3: Mass Production & Product Launch
Duration: 9 months
Based on prototyping results, optimize the manufacturing process for mass production and conduct cost evaluations. Subsequently, integrate the technology into the licensee's existing products, aiming for market launch.
Technical Feasibility
This technology uses a thermoplastic resin as its base material, making it relatively easy to apply to existing general-purpose resin processing equipment like injection molding or press molding. The patent specification explicitly details the blending ratio of PMMA and BN particles, along with orientation control methods. Leveraging this technical knowledge could minimize new large-scale capital investment and enable rapid adoption. The availability of BN particles and PMMA in existing material supply chains also lowers the barrier to entry.
Success Scenario
If this technology is adopted, a licensee's power semiconductor modules and battery packs could become smaller and lighter. This may enhance product design flexibility and is estimated to reduce the total number of cooling system components and power consumption. Consequently, manufacturing costs could decrease, boosting market competitiveness. Furthermore, by suppressing heat generation, the reliability and lifespan of electronic components may improve, potentially contributing to long-term maintenance cost reductions.
Patent Record
APPLICATION NO.
特願2021-086834
REGISTRATION NO.
7174973
FILING DATE
2021/05/24
GRANT DATE
2022/11/10
EXPIRATION DATE
2041/05/24
PATENT HOLDER
国立大学法人豊橋技術科学大学
Examination History
2021年05月25日
出願審査請求書
2022年06月07日
拒絶理由通知書
2022年07月10日
意見書
2022年07月10日
手続補正書（自発・内容）
2022年10月04日
特許査定