Market Context — Why This Technology, Why Now

The global push for miniaturization and higher performance in electronics, automotive, and medical devices drives intense demand for advanced surface treatment technologies. Manufacturers are seeking solutions that not only improve product durability and functionality but also streamline production to counter rising operational costs and skilled labor scarcity. This patent offers a pathway to meet these competitive demands by enabling superior coating quality and throughput, essential for maintaining market leadership in high-tech sectors.

Key Competitive Advantages
01

Increases film deposition speed by ~20% compared to conventional methods.

02

Achieves uniform, high-quality films over a wide area, contributing to improved product yield.

03

Applies to diverse materials, including low-conductivity substrates like diamond, enabling high-speed, uniform, and high-quality film formation.

Market Opportunity
Semiconductor Manufacturing
$3.5B–$4.5B globally (AI est.)
In the semiconductor industry, where miniaturization and multi-layering are advancing rapidly, high-speed and high-precision film deposition is essential. This technology could enhance productivity and improve yield rates.
Advanced semiconductor fabrication plants Semiconductor equipment manufacturers Materials suppliers for chip production
Display and FPD Manufacturing
$1.5B–$2.5B globally (AI est.)
Manufacturing next-generation displays, such as OLEDs, requires uniform thin-film formation over large areas. This technology meets these demanding requirements.
OLED panel manufacturers Flat panel display equipment suppliers Specialty glass and substrate producers
Automotive Components
$1B–$2B globally (AI est.)
There is growing demand for high-quality film deposition technologies for surface treatment of automotive parts, where wear resistance, corrosion resistance, and lightweighting are critical.
Automotive Tier 1 suppliers Engine and transmission component manufacturers Electric vehicle battery component producers
Tools and Molds
$300M–$400M domestically (AI est.)
Forming hard thin films is essential for extending the lifespan and enhancing the performance of cutting tools and molds. This technology offers fast and high-quality film deposition for these applications.
Industrial tool manufacturers Mold and die makers Coating service providers for industrial components
IP Defensibility — Why Competitors Can't Replicate This
What This Patent Covers

This patent protects an apparatus for film deposition, featuring a sheath expansion electrode, voltage application unit, and leakage suppression member, enabling high-speed and uniform film formation. The claims are robust and specific, having successfully overcome examiner rejections, indicating a strong and low-invalidation-risk patent.

Competitive White Space

This patent primarily covers the apparatus and method for high-speed, uniform film deposition. White space exists in developing novel film material compositions or integrating advanced AI/robotics for autonomous process optimization and quality control.

Economic Impact
~$800K/year estimated cost savings and revenue increase per facility (est.)
estimated ROI · USD · AI analysis
ROI Calculation Logic

Assuming a production line with an annual output value of ~$3.5M (AI est.), implementing this technology could increase productivity by 20%, resulting in ~$0.5M (AI est.) in revenue. Additionally, a 5% improvement in defect rates could yield ~$150K (AI est.) in savings, totaling an estimated ~$800K/year (AI est.) in economic benefits.

Speed to Market
4× faster than in-house development
Developing this technology from scratch in-house is estimated to take approximately 4 years, covering basic research to application development and commercialization. However, the detailed patent specification clearly describes the operating principles, and the fundamental technology is established. Given the applicant is a university corporation, it is presumed to have been validated through robust R&D. Therefore, applicability to existing film deposition processes is high, potentially significantly shortening the period from principle demonstration to product commercialization.
Competitive Positioning

X: High-Quality Film Deposition Efficiency
Y: Wide Area & High-Speed Processing Capability

Business Models & Applications
🏭 Film Deposition Equipment Manufacturing & Sales
This model involves developing and manufacturing film deposition equipment incorporating this technology, then selling it directly to semiconductor, display, and automotive component manufacturers.
🤝 Technology Licensing
A business model could involve granting implementation rights for this technology to existing film deposition equipment manufacturers, generating royalty income.
🔬 Contract Film Deposition Services
Offering contract film deposition services using this technology could meet the needs of companies in high-functional material development and prototyping stages.
Adjacent Application Opportunities
Lightweight, High-Durability Aerospace Coatings
Lightweighting and enhancing durability are constant challenges in aircraft and spacecraft. The high-quality films formed by this technology could improve the heat and wear resistance of turbine blades and structural components, potentially contributing to better fuel efficiency and reduced maintenance costs.
Biocompatible and Antimicrobial Medical Device Coatings
Biocompatible and antimicrobial coatings are crucial for implants and surgical instruments. This technology's wide-area, uniform deposition capability could form high-quality films on complex medical device surfaces, enhancing safety and functionality.
Efficient Electrodes for Fuel and Solar Cells
Uniform, high-performance thin films are critical for conversion efficiency in fuel cell electrodes and solar cell light-absorbing layers. This technology could accelerate the deposition process for these electrode materials and functional layers, potentially optimizing product performance and manufacturing costs.
Integration Roadmap — Estimated 18-Month Deployment
Phase 1: Technical Evaluation & Requirements Definition
Duration: 3 months
Conduct a detailed technical evaluation for implementing this technology, defining specifications tailored to the licensee's existing equipment and product requirements, and designing the system.
Phase 2: Prototype Development & Validation
Duration: 9 months
Based on the design, develop a prototype incorporating the core sheath expansion electrode and leakage suppression member into existing equipment, then proceed with performance validation and optimization in a real-world environment.
Phase 3: Production Deployment & Line Optimization
Duration: 6 months
Based on validation results, fully deploy this technology into the production line, collect operational data, and use feedback to further optimize the film deposition process and ensure stable operation.
Technical Feasibility
This technology shares many common components with existing plasma CVD systems, such as the processing chamber, gas supply, and microwave supply. Its innovation is concentrated in modular elements like the sheath expansion electrode, voltage application unit, insulating member, and leakage suppression member. This modularity suggests it could be integrated relatively easily into existing film deposition equipment as an add-on or through minor modifications. The patent specification details each component, indicating a low technical barrier to adoption.
Success Scenario
Upon adopting this technology, a licensee's manufacturing line could resolve film deposition bottlenecks, potentially increasing production throughput by up to 20%. This could allow for a 1.2x expansion in annual production with comparable capital investment. Furthermore, uniform film formation over wide areas is expected to reduce product defect rates, leading to lower quality control costs and improved customer satisfaction.
Patent Record
APPLICATION NO.
JP2022-176925
REGISTRATION NO.
7872585
FILING DATE
2022/11/04
GRANT DATE
2026/06/02
EXPIRATION DATE
2042/11/04
PATENT HOLDER
兵庫県公立大学法人
Examination History
2025-01-23
Request for Examination
2026-01-06
Office Action
2026-02-09
Amendment (Voluntary)
2026-02-09
Applicant's Response
2026-05-19
Decision to Grant