The accelerating demand for flexible, high-performance electronics in consumer, industrial, and medical sectors is creating a critical need for more robust component technologies. As devices become smaller and more integrated into daily life, their ability to withstand repeated stress, such as bending and flexing, directly impacts user experience and product longevity. This patent offers a solution to a fundamental failure point, enabling manufacturers to meet stringent reliability standards and differentiate products in a highly competitive market.
Increases bending durability by 3x, potentially extending product lifespan and reliability.
Enhances design flexibility for thin, flexible devices through optimized connection member placement.
Improves manufacturing yield by up to 20% by reducing connection defect risks in production.
This patent establishes a robust foundation, having overcome a rejection notice with precise arguments and amendments. Its 11 claims comprehensively define a unique connection structure between conductive layers in piezoelectric film laminates, making it a strong, difficult-to-invalidate patent.
While the patent strongly protects the internal connection structure of piezoelectric laminates, it leaves room for innovation in the specific piezoelectric materials used or in the integration of these laminates into advanced sensor arrays and complex device architectures.
Assuming a reduction in flexible sensor product field failure rate from 5% to 1%. For 500,000 units shipped annually, repair costs of $33.50/unit (AI est.) could be reduced by ~$67K (AI est.). An additional ~$67K (AI est.) in on-site labor cost reduction is also estimated, totaling ~$130K/year (AI est.).
X: Bending Durability & Reliability
Y: Miniaturization & Design Flexibility